搜索結(jié)果
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[行業(yè)動(dòng)態(tài)]破解SIP集成瓶頸:AIN與LTCC陶瓷基板如何解決散熱與密度難題?
2025-11-19 http://www.nxyjh.com/Article/pojieSIPjichengpingj.html
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[行業(yè)動(dòng)態(tài)]陶瓷基板技術(shù)解析:DBC與AMB的差異與應(yīng)用選擇
2025-07-31 http://www.nxyjh.com/Article/taocijibanjishujiexi.html
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[行業(yè)動(dòng)態(tài)]氮化硅陶瓷基板:新能源汽車電力電子的散熱革新
2025-07-17 http://www.nxyjh.com/Article/danhuaguitaocijibanx.html
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[行業(yè)動(dòng)態(tài)]高功率電子器件散熱的關(guān)鍵:氮化鋁與氮化硅陶瓷基板
2025-07-03 http://www.nxyjh.com/Article/gaogonglvdianziqijia.html
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[行業(yè)動(dòng)態(tài)]氮化硅AMB陶瓷覆銅基板界面空洞率的關(guān)鍵技術(shù)與工藝探索
2025-07-01 http://www.nxyjh.com/Article/danhuaguiAMBtaocifut.html
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[行業(yè)動(dòng)態(tài)]氮化鋁陶瓷基板:破解高熱導(dǎo)率散熱材料的制備難題
2025-06-28 http://www.nxyjh.com/Article/danhualvtaocijibanpo.html
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[行業(yè)動(dòng)態(tài)]國(guó)產(chǎn)AMB陶瓷基板突破封鎖:高端電子材料的逆襲之路
2025-06-26 http://www.nxyjh.com/Article/guochanAMBtaocijiban.html
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[行業(yè)動(dòng)態(tài)]LED散熱基板的三大類型及其發(fā)展趨勢(shì)
2025-06-14 http://www.nxyjh.com/Article/LEDsanrejibandesanda.html
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[行業(yè)動(dòng)態(tài)]陶瓷覆銅基板剝離強(qiáng)度測(cè)試與性能分析
2025-06-10 http://www.nxyjh.com/Article/taocifutongjibanbaol.html
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[行業(yè)動(dòng)態(tài)]氮化鋁基板加工:技術(shù)與應(yīng)用的深度剖析
2025-06-05 http://www.nxyjh.com/Article/danhualvjibanjiagong.html
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[行業(yè)動(dòng)態(tài)]Bosch Research通過3D打印技術(shù)制造陶瓷覆銅基板
2024-08-13 http://www.nxyjh.com/Article/BoschResearchtongguo.html
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[行業(yè)動(dòng)態(tài)]銀銅鈦 (AgCuTi) 為何在IGBT上應(yīng)用
2024-03-11 http://www.nxyjh.com/Article/yintong(AgCuTi)weihe.html
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[行業(yè)動(dòng)態(tài)]陶瓷覆銅基板抗彎強(qiáng)度介紹
2023-12-15 http://www.nxyjh.com/Article/taocifutongjibankang.html
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[行業(yè)動(dòng)態(tài)]Si3N4-AMB陶瓷基板的應(yīng)用
2023-11-15 http://www.nxyjh.com/Article/Si3N4-AMBtaocijiband.html
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[行業(yè)動(dòng)態(tài)]IGBT模塊中不同金屬化方法覆銅氮化鋁陶瓷基板的可靠性研究
2023-09-15 http://www.nxyjh.com/Article/IGBTmokuaizhongbuton.html
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[行業(yè)動(dòng)態(tài)]Si3N4-AMB陶瓷基板在高功率半導(dǎo)體器件中的應(yīng)用
2023-08-28 http://www.nxyjh.com/Article/Si3N4-AMBtaocijibanz.html
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[行業(yè)動(dòng)態(tài)]陶瓷基板的現(xiàn)狀及發(fā)展淺析
2023-07-28 http://www.nxyjh.com/Article/taocijibandexianzhua.html
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[行業(yè)動(dòng)態(tài)]DBC直接鍵合陶瓷基板特性及應(yīng)用
2023-07-26 http://www.nxyjh.com/Article/DBCzhijiejianhetaoci.html
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[行業(yè)動(dòng)態(tài)]陶瓷基板工藝簡(jiǎn)介
在電子陶瓷封裝中,陶瓷基板除了為電路和芯片提供結(jié)構(gòu)支撐和電氣互連,還必須為其提供良好的熱處理以確保正常工作。
2023-07-17 http://www.nxyjh.com/Article/taocijibangongyijian.html
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[行業(yè)動(dòng)態(tài)]大功率IGBT功率模塊用氮化鋁覆銅基板
2023-04-17 http://www.nxyjh.com/Article/dagonglvIGBTgonglvmo.html

